Rapid Prototyping: Laser-Based and Other Technologies

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Springer Science & Business Media, 2004 - Computers - 389 pages
Owing to the development and rapid spread of communication technologies including the Internet, the world is indeed turning into a global village. The rate of introduction of new products and technologies is steadily rising. At the same time, pressures to reduce time-to-market are mounting. Only companies that are able to realize products rapidly are able to survive today. From a technological viewpoint, rapid product realization involves rapid design, rapid prototyping, and rapid tooling. Fortunately, a class of technologies, also collectively called rapid prototyping (RP) technologies, has emerged in the last two decades or so to meet these requirements. Early technologies merely aimed to produce single part look-alikes. However, intense R&D efforts are taking place around the world to go beyond mere `look alike' single part prototyping, into functional, multi-part assemblies. RP technologies are different from other modern manufacturing technologies in many ways. In RP, material is usually added incrementally in a layered manner and, occasionally, subtracted. Some technologies depend upon layers of resin cured under the influence of one or more CNC controlled laser beams. Others use lasers to selectively sinter layers of powdered metal. There are also RP technologies that do not use lasers at all. Indeed, RP is turning out to be a potent arena for technological creativity. This book provides an updated overview of RP technologies at a level of detail that university engineering students taking courses on RP as well R&D and operating professionals from industry interested in RP are likely to find attractive. While the emphasis is on laser-based technologies, other processes are also discussed. With respect to each important RP process, the part/assembly modeling techniques, the materials used, process itself, advantages and disadvantages, accuracy and finish issues as well as application potential are discussed.
 

Contents

I
xi
II
1
III
25
IV
57
V
75
VI
135
VII
195
VIII
245
IX
279
X
311
XI
329
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