34 pages matching decrease in this book
What people are saying - Write a review
We haven't found any reviews in the usual places.
33 other sections not shown
1997 Materials Research adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical CMP process coating copolymers cured films curve decrease delamination density device dielectric constant dielectric material diffusion e-beam cured electron Figure film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N passivation peak PECVD permittivity planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si SiF4 silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch
sciencedirect - Scripta Materialia : Thickness dependence of ...