Engineering Materials ScienceMilton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the fundamental background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design, processing materials into useful products, andhow material degrade and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing; mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability. The book offers superior coverage of electrical, optical, and magnetic materials than competing text.The author has taught introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has also written the well-received book, The Material Science of Thin Films (Academic Press). Key Features* Provides a modern treatment of materials exposing the interrelated themes of structure, properties, processing, and performance* Includes an interactive, computationally oriented, computer disk containing nine modules dealing with structure, phase diagrams, diffusion, and mechanical and electronic properties* Fundamentals are stressed* Of particular interest to students, researchers, and professionals in the field of electronic engineering |
Contents
1 | |
29 | |
71 | |
135 | |
189 | |
CHAPTER 6 KINETICS OF MASS TRANSPORT AND PHASE TRANSFORMATIONS | 249 |
CHAPTER 7 MECHANICAL BEHAVIOR OF SOLIDS | 299 |
CHAPTER 8 MATERIALS PROCESSING AND FORMING OPERATIONS | 371 |
CHAPTER 13 OPTICAL PROPERTIES OF MATERIALS | 665 |
CHAPTER 14 MAGNETIC PROPERTIES OF MATERIALS | 711 |
CHAPTER 15 FAILURE AND RELIABILITY OF ELECTRONIC MATERIALS AND DEVICES | 747 |
PROPERTIES OF SELECTED ELEMENTS AT 20C | 789 |
VALUES OF SELECTED PHYSICAL CONSTANTS | 791 |
CONVERSION FACTORS | 793 |
ANSWERS TO SELECTED PROBLEMS | 795 |
801 | |
CHAPTER 9 HOW ENGIHEERING MATERIALS ARE STRENGTHENED AND TOUGHENED | 431 |
CHAPTER 10 DEGRADATION AND FAILURE OF STRUCTURAL MATERIALS | 501 |
CHAPTER 11 ELECTRICAL PROPERTIES OF METALS INSULATORS AND DIELECTRICS | 559 |
CHAPTER 12 SEMICONDUCTOR MATERIALS AND DEVICES SCIENCE AND TECHNOLOGY | 611 |
DOCUMENTATION FOR COMPUTER MODULES | 828 |
Color Plate Section | 833 |
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Common terms and phrases
alloy aluminum annealed anode applications atoms austenite band behavior bonds carbon casting cell ceramics Chapter chemical components composition compressive concentration conduction conduction band constant cooling corrosion covalent bonds crack crystal crystalline cubic curve deformation density devices dielectric diffusion dislocation dopant doping ductile effects elastic electric field electron emission energy Engineering Materials equilibrium eutectic example failure ferromagnetic fibers FIGURE films fracture function GaAs glass grain boundaries hardening heat insulators interface ionic ions laser lattice levels liquid load magnetic martensite matrix mechanical melt metals modulus mold molecules nucleation occurs optical oxide oxygen p-n junction pearlite phase diagram photon plane plastic polarization polymer processing properties reaction schematically Section semiconductor shown in Fig silicon sintering SiO2 solid steel strain strength stress structure substrate superconductor surface temperature tensile thermal tion transformation transistors valence band values voltage wavelength yield Young's modulus