Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 107
... function of the surface chemistry of the nanoporous silica . Figure 1 Variation in calculated refractive index and dielectric constant as a function silica moisture content PORE SIZE DISTRIBUTION One potential concern with the use of.
... function of the surface chemistry of the nanoporous silica . Figure 1 Variation in calculated refractive index and dielectric constant as a function silica moisture content PORE SIZE DISTRIBUTION One potential concern with the use of.
Page 143
... function of thickness for PPXC in the as - deposited condition and PPXN as - deposited , after a 200 ° C anneal , and after a 325 ° C anneal . Above a critical thickness of ~ 112nm PPXN's as - deposited birefringence changed only ...
... function of thickness for PPXC in the as - deposited condition and PPXN as - deposited , after a 200 ° C anneal , and after a 325 ° C anneal . Above a critical thickness of ~ 112nm PPXN's as - deposited birefringence changed only ...
Page 335
... function of time showing the history of a dry AI / PAE2 sample tested in a moisture saturated environment . The load was increased rapidly by stepping the displacement at a high rate so that crack growth in this period of time was ...
... function of time showing the history of a dry AI / PAE2 sample tested in a moisture saturated environment . The load was increased rapidly by stepping the displacement at a high rate so that crack growth in this period of time was ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films