Low-dielectric Constant Materials-- Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
Contents
Methods and Needs for Low K Material Research | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
27 other sections not shown
Common terms and phrases
1995 Materials Research absorption adhesion aerogels alternating copolyimide ambient anisotropy annealing applications BPDA-PDA bulk capacitance chemical chemical vapor deposition coating copolymer copper cured density device dianhydride dielectric film dielectric materials dielectric properties DVS-bisBCB electrical electronic FAST-SOG film thickness fluorescent fluorinated fluorinated polyimide frequency FTIR glass transition temperature IEEE Trans insulating integrated circuits interface interlayer dielectric labile block layer low dielectric constant lower Materials Research Society measurements mechanical properties metal microelectronic micron modulus moisture monomers Multilevel Interconnection optical organic polymers out-of-plane Parylene patterns permittivity planarization plasma polish rate polyimide film polymeric polystyrene Proc refractive index resin resonators RTCVD-SiOF sample shown in Figure silica silica aerogels silicon dioxide silicon wafers siloxane SiO2 slurry SOG film solvent spin-coated spin-on stress substrate surface Symp Table technique Technology test structure thermal expansion coefficient thermal stability thin films vapor deposition