Low-dielectric Constant Materials-- Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.
Materials Research Society, 1995 - Electric insulators and insulation - 288 pages
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Methods and Needs for Low K Material Research
Fluorinated Low Thermal Expansion Coefficient Polyimides
Investigations of the Low Dielectric Constant Fluorinated
27 other sections not shown
absorption adhesion aerogels alternating copolyimide anisotropy annealing applications BPDA-PDA bulk capacitance chemical chemical vapor deposition coating constant materials copolymer copper cured density device dielectric film dielectric materials dielectric properties DVS-bisBCB electrical electronic FAST-SOG film thickness films deposited fluorescent fluorinated fluorinated polyimide frequency FTIR glass transition temperature IEEE Trans insulating integrated circuits interface interlayer dielectric labile block layer low dielectric constant lower Materials Research Society measurements mechanical properties metal microelectronic micron modulus moisture monomers Multilevel Interconnection optical organic polymers out-of-plane Parylene patterns permittivity planarization plasma plasma treatment polish rate polyimide film polymeric polystyrene Proc refractive index resin resonators sample shown in Figure silica silica aerogels silicon dioxide silicon wafers siloxane SiO2 SiO2 films slurry SOG film solvent spin-coated spin-on stress substrate surface Symp Table technique Technology test structure thermal expansion coefficient thermal stability thin films vapor deposition