Metallurgy of Welding

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William Andrew, Jan 1, 1999 - Technology & Engineering - 446 pages
A well-established and respected textbook from an author who is a recognized authority in this field. Joining techniques are one of the key technologies in materials engineering and this book provides comprehensive coverage of the subject. It is intended for undergraduate and graduate students of metallurgy, as well as those attending specialist welding courses. It is also a valuable source of reference for practicing engineers and metallurgists concerned with joining processes.
The text covers the metallurgical changes that take place during the welding process, the properties of welded joints, defects associated with welding and the behavior of welded joints in service. There is a chapter devoted to joints between metals and ceramics, and on the use of structural adhesives. The various techniques used in microwelding and the joining of solid-state devices to printed circuit boards are briefly described.
In addition to revising and updating the text throughout the author has made some specific alterations and additions to the book: Brittle and ductile behavior of solids, ductile fracture, and the velocity of crack propagation are now in the section on Fracture. Friction stir welding is included. There is an additional chapter on adhesive bonding, including bonding forces, polymer chemistry, types of adhesive, production technology, quality control and applications. The section on heat flow has been expanded with worked examples. A section on weld defects and the evaluation of nondestructive tests has been added. A section on the welding metallurgy of aluminium-lithium alloys has been added. A new section describes major structural failure in such catastrophes as the "AlexanderL Kielland" accident and the Kobe earthquake, and considers the role of welding in such failures.

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About the author (1999)

John Lancaster was Visiting Professor at Aston University from 1971 to 1976, and in 1980 was appointed Guest Professor at the University of Tientsin, China.

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