Microsystem TechnologyThis completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating. |
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Page viii
... Plasma Assisted Deposition 139 4.5.4 Ion Cluster Beam Technology 140 4.5.5 CVD Processes 143 4.5.6 ... Dry Etch Processes Physical Etch Technologies 151 155 4.6.2 Combined Physical and Chemical Etch Technologies 158 4.6.3 Chemical Etching ...
... Plasma Assisted Deposition 139 4.5.4 Ion Cluster Beam Technology 140 4.5.5 CVD Processes 143 4.5.6 ... Dry Etch Processes Physical Etch Technologies 151 155 4.6.2 Combined Physical and Chemical Etch Technologies 158 4.6.3 Chemical Etching ...
Page ix
... Etching 220 6.2.3 Basic Etch Shapes 227 6.2.4 Etching Control 234 6.2.5 6.2.6 6.3 Surface Micromachining 6.3.1 Characterization of Anisotropic Wet Etchants Dry Etching . . . Polysilicon Micromachining 6.3.2 Sacrificial Aluminum ...
... Etching 220 6.2.3 Basic Etch Shapes 227 6.2.4 Etching Control 234 6.2.5 6.2.6 6.3 Surface Micromachining 6.3.1 Characterization of Anisotropic Wet Etchants Dry Etching . . . Polysilicon Micromachining 6.3.2 Sacrificial Aluminum ...
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Contents
4 | 4 |
2 | 117 |
5 | 133 |
6 | 151 |
7 | 164 |
Resists | 171 |
6 | 192 |
7 | 202 |
5 | 324 |
6 | 341 |
2 | 394 |
9 | 403 |
2 | 413 |
4 | 420 |
6 | 428 |
System Technology | 431 |
Application of Xray Lithography | 208 |
2 | 215 |
3 | 248 |
4 | 257 |
5 | 287 |
Literatur | 465 |
485 | |
492 | |
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Common terms and phrases
acceleration achieved actuators adhesion anisotropic applications array atoms Baltes bonding chemical circuit CMOS components density depends deposition devices diameter dielectric diffusion doping dry etching electrical electrolyte electron beam electroplating energy etch process etch rate etchant fabricated fluidic heat IEEE injection molding integrated integrated circuit interfaces ions isotropic Karlsruhe laser lattice LIGA process liquid magnetic manufacturing mask material mbar mechanical membrane metal method micro microelectronics micromachining microstructure technology microstructures microsystem technology modules mold insert molecular molecules optical output oxide parameters particles pattern phase photolithography photoresist piezoelectric planes plasma plastic plate PMMA polymer polysilicon pressure Proc produced pump reaction region resist layer schematically Section semiconductor sensor sensor elements shown in Fig signal processing silicon single crystal sputtering structure substrate surface surface micromachining synchrotron radiation techniques temperature thermal thickness thin films tion titanium transfer vacuum voltage wafer wavelength wire X-ray lithography
Popular passages
Page 480 - DR Sparks, SR Zarabadi, JD Johnson, Q. Jiang, M. Chia. O. Larsen, W. Higdon, P. Castillo-Borelley: A CMOS Integrated Surface Micromachined Angular Rate Sensor, Its Automotive Applications; Digest of Technical Papers of Tansducers 97, Chicago, USA, June 16-19, 1997, Vol.