Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 13
... Material / Process Development " , Proc . of the 1995 VMIC State - of- the - Art Seminar , p . 113-168 , June 30 , 1995 , Santa Clara , CA. 15. B. Auman , personal communication , Nov. 1996 16. B.T. Ahlburn , G.A. Brown , T.R. Seha ...
... Material / Process Development " , Proc . of the 1995 VMIC State - of- the - Art Seminar , p . 113-168 , June 30 , 1995 , Santa Clara , CA. 15. B. Auman , personal communication , Nov. 1996 16. B.T. Ahlburn , G.A. Brown , T.R. Seha ...
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... ( 1995 ) . 3. T. Usami , K. Shimokawa , and M. Yoshimaru , Jpn . J. Appl . Phys . , 33 ( 1 ) , 1B , p . 408 , ( 1994 ) . 4. R. A. Flinn , P. K. Trojan , Engineering Materials ... Materials Research Society Symposium Proceedings , vol . 265 , p ...
... ( 1995 ) . 3. T. Usami , K. Shimokawa , and M. Yoshimaru , Jpn . J. Appl . Phys . , 33 ( 1 ) , 1B , p . 408 , ( 1994 ) . 4. R. A. Flinn , P. K. Trojan , Engineering Materials ... Materials Research Society Symposium Proceedings , vol . 265 , p ...
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... Science 3 ( 2 ) , 61 ( 1995 ) ; ( e ) A. Morikawa , Y. Iyoku , M. Kakimoto and Y. Imai , J. Mater . Sci . 2 ( 7 ) , 679 ( 1992 ) ; ( f ) B. Wang , G. L. Wilkes , C. D. Smith and J. E. McGrath , Polym . Commun . ( 32 ( 13 ) , 400 ( 1991 ) ...
... Science 3 ( 2 ) , 61 ( 1995 ) ; ( e ) A. Morikawa , Y. Iyoku , M. Kakimoto and Y. Imai , J. Mater . Sci . 2 ( 7 ) , 679 ( 1992 ) ; ( f ) B. Wang , G. L. Wilkes , C. D. Smith and J. E. McGrath , Polym . Commun . ( 32 ( 13 ) , 400 ( 1991 ) ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films