Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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... 1997 by Materials Research Society . All rights reserved . This book has been registered with Copyright Clearance ... Materials Research Society 506 Keystone Drive Warrendale ,, Pennsylvania 15086 Telephone ( 412 ) 779-3003 Fax ( 412 ) ...
... 1997 by Materials Research Society . All rights reserved . This book has been registered with Copyright Clearance ... Materials Research Society 506 Keystone Drive Warrendale ,, Pennsylvania 15086 Telephone ( 412 ) 779-3003 Fax ( 412 ) ...
Page x
... 1997 , ISBN : 1-55899-327-4 Volume 425- Liquid Crystals for Advanced ... 1997 , ISBN : 1-55899-335-5 Volume 433 ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical Materials Research Society Symposium Proceedings.
... 1997 , ISBN : 1-55899-327-4 Volume 425- Liquid Crystals for Advanced ... 1997 , ISBN : 1-55899-335-5 Volume 433 ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical Materials Research Society Symposium Proceedings.
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... 1997 , ISBN : 1-55899-348-7 Volume 445- Electronic Packaging Materials Science IX , P.S. Ho , S.K. Groothuis , K. Ishida , T. Wu , 1997 ... Materials Research Society Low - Dielectric Constant Materials II Low Dielectric Constant Materials.
... 1997 , ISBN : 1-55899-348-7 Volume 445- Electronic Packaging Materials Science IX , P.S. Ho , S.K. Groothuis , K. Ishida , T. Wu , 1997 ... Materials Research Society Low - Dielectric Constant Materials II Low Dielectric Constant Materials.
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films