Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 16
... FTIR ) spectroscopy to compare differences in molecular chain orientation of our VDP PMDA - ODA films with their spin cast counterparts . As described below , ATR FTIR spectroscopy is ideally suited to the study molecular orientation ...
... FTIR ) spectroscopy to compare differences in molecular chain orientation of our VDP PMDA - ODA films with their spin cast counterparts . As described below , ATR FTIR spectroscopy is ideally suited to the study molecular orientation ...
Page 17
... FTIR signal is dominated by the out of plane electric field component , unlike a transmission FTIR measurement . ( 2 ) While ATR FTIR polyimide spectra can be obtained by depositing the film on a wafer and pressing the wafer against the ...
... FTIR signal is dominated by the out of plane electric field component , unlike a transmission FTIR measurement . ( 2 ) While ATR FTIR polyimide spectra can be obtained by depositing the film on a wafer and pressing the wafer against the ...
Page 86
... FTIR FTIR data for PTFE films is shown in Figure 2. Significant amounts of C - F bonds ( 1153 cm - 1 and 1211 cm - 1 ) were detected in the films . 0.20 0.15 0.10 0,05 0.00 4000 3500 3000 2500 2000 1500 1000 500 Wavenumber Figure 2. FTIR ...
... FTIR FTIR data for PTFE films is shown in Figure 2. Significant amounts of C - F bonds ( 1153 cm - 1 and 1211 cm - 1 ) were detected in the films . 0.20 0.15 0.10 0,05 0.00 4000 3500 3000 2500 2000 1500 1000 500 Wavenumber Figure 2. FTIR ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber