Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
From inside the book
Results 1-3 of 92
Page iv
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center ... Materials Research Society Symposium Proceedings.
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center ... Materials Research Society Symposium Proceedings.
Page x
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 420— Amorphous Silicon Technology - 1996 , M. Hack ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical Materials Research Society Symposium Proceedings.
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 420— Amorphous Silicon Technology - 1996 , M. Hack ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical Materials Research Society Symposium Proceedings.
Page xi
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical and Optical Microsystems , M.L. Reed , M ... Materials Research Society Low - Dielectric Constant Materials II Low Dielectric Constant Materials.
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 444— Materials for Mechanical and Optical Microsystems , M.L. Reed , M ... Materials Research Society Low - Dielectric Constant Materials II Low Dielectric Constant Materials.
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
23 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films