Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 85
... PTFE was developed that permits the spin - coat deposition of PTFE with a thickness range of 0.2 to 1.5 μm . These PTFE nanoemulsions are aqueous emulsions containing sub - 50 nm size PTFE particles and surfactant that are ...
... PTFE was developed that permits the spin - coat deposition of PTFE with a thickness range of 0.2 to 1.5 μm . These PTFE nanoemulsions are aqueous emulsions containing sub - 50 nm size PTFE particles and surfactant that are ...
Page 88
... PTFE . This may be attributed to the low modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a ...
... PTFE . This may be attributed to the low modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a ...
Page 89
... PTFE film . Processing The weight change rate for PTFE films in sulfuric acid , buffered HF , and positive photoresist developer is essentially zero . The films may be etched in an oxygen plasma system . NDL has measured an etch rate of ...
... PTFE film . Processing The weight change rate for PTFE films in sulfuric acid , buffered HF , and positive photoresist developer is essentially zero . The films may be etched in an oxygen plasma system . NDL has measured an etch rate of ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films