Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 12
... VLSI Technology , 59 ( 1994 ) . 2 . C.H. Ting , presented at SRC Topical Research Conf . Workshop on Low & Interlayer Dielectrics for High Performance Circuits , RPI , Troy , NY , Aug. 9-10 , 1994 . 3. F.W. Mercer and R. Sovich , U.S. ...
... VLSI Technology , 59 ( 1994 ) . 2 . C.H. Ting , presented at SRC Topical Research Conf . Workshop on Low & Interlayer Dielectrics for High Performance Circuits , RPI , Troy , NY , Aug. 9-10 , 1994 . 3. F.W. Mercer and R. Sovich , U.S. ...
Page 182
... VLSI Multilevel Interconnection Conference , p . 116 , June . 27-29 , 1995 . 10. L. Forester , D. K. Choi , R. Hosseini , J. Lee , B. Tredinnick , K. Holland , T. Cale , VLSI Multilevel Interconnection Conference , p . 482 , June . 27 ...
... VLSI Multilevel Interconnection Conference , p . 116 , June . 27-29 , 1995 . 10. L. Forester , D. K. Choi , R. Hosseini , J. Lee , B. Tredinnick , K. Holland , T. Cale , VLSI Multilevel Interconnection Conference , p . 482 , June . 27 ...
Page 200
... VLSI Multilevel Interconnect Conference ( VMIC ) , ed . by T. Wade , pp . 180ff , 1992 [ 2 ] B.C. Auman , in Proceedings of the 1. Dielectrics for VLSI / ULSI Multilevel Interconnect Conference , ed . by T. Wade , pp . 297ff , 1995 [ 3 ] ...
... VLSI Multilevel Interconnect Conference ( VMIC ) , ed . by T. Wade , pp . 180ff , 1992 [ 2 ] B.C. Auman , in Proceedings of the 1. Dielectrics for VLSI / ULSI Multilevel Interconnect Conference , ed . by T. Wade , pp . 297ff , 1995 [ 3 ] ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber