Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 79
... Adhesion of copper to fluoropolymers was studied using scratch and peel tests . Different thermal treatment techniques were applied to enhance adhesion , including preannealing in vacuum or in atmosphere , as well as postannealing in ...
... Adhesion of copper to fluoropolymers was studied using scratch and peel tests . Different thermal treatment techniques were applied to enhance adhesion , including preannealing in vacuum or in atmosphere , as well as postannealing in ...
Page 88
... adhesion , and a rough surface as evidence of good adhesion ( cohesive failure of the PTFE ) . The main benefit of the method is that it is very fast . Gore has conducted a series of factorial experiments with the goal of improving adhesion ...
... adhesion , and a rough surface as evidence of good adhesion ( cohesive failure of the PTFE ) . The main benefit of the method is that it is very fast . Gore has conducted a series of factorial experiments with the goal of improving adhesion ...
Page 165
... adhesion between the a - C : F and SiO2 films was dramatically improved by inserting an adhesion promoter consisting of a - C : H and Si - rich SiO2 . INTRODUCTION Multilevel interconnection is a key technology for achieving high ...
... adhesion between the a - C : F and SiO2 films was dramatically improved by inserting an adhesion promoter consisting of a - C : H and Si - rich SiO2 . INTRODUCTION Multilevel interconnection is a key technology for achieving high ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber