Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 10
... carbon " , or " diamond- like carbon " ( DLC ) . In general , these materials are composed of highly crosslinked hydrocarbon and fluorinated hydrocarbon structures in which carbon atoms exhibit mixtures of sp2 and sp3 hybridization . 3 ...
... carbon " , or " diamond- like carbon " ( DLC ) . In general , these materials are composed of highly crosslinked hydrocarbon and fluorinated hydrocarbon structures in which carbon atoms exhibit mixtures of sp2 and sp3 hybridization . 3 ...
Page 44
... carbon and suggests that the film may be decomposing to some extent as it is being deposited . Such trends imply a loss of fluorine in the film and a resulting increase in crosslinked structure . The former has been confirmed by ESCA ...
... carbon and suggests that the film may be decomposing to some extent as it is being deposited . Such trends imply a loss of fluorine in the film and a resulting increase in crosslinked structure . The former has been confirmed by ESCA ...
Page 165
... carbon thin films ( a - C : F ) for use as low - dielectric - constant interlayer dielectrics were deposited by helicon - wave plasma - enhanced chemical vapor deposition using fluorocarbon compounds as a source material . The a - C : F ...
... carbon thin films ( a - C : F ) for use as low - dielectric - constant interlayer dielectrics were deposited by helicon - wave plasma - enhanced chemical vapor deposition using fluorocarbon compounds as a source material . The a - C : F ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber