Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 38
... minutes with no degradation of the Cr specularity . Adhesion of the Cr on the PFCB , assessed by tape peel , was retained after the thermal. Chromium and Cobalt on PFCB Figure 4. Transmission electron micrographs of 20 % PMDA -. 38 888.
... minutes with no degradation of the Cr specularity . Adhesion of the Cr on the PFCB , assessed by tape peel , was retained after the thermal. Chromium and Cobalt on PFCB Figure 4. Transmission electron micrographs of 20 % PMDA -. 38 888.
Page 203
... chromium , 35 parylene , 3 , 21 PECVD , 41 , 119 , 127 , 137 , 143 , 165 , 183 , 189 perfluorocyclobutane ( PFCB ) , 3 , 35 , 177 poly ( aryl ) ether ( s ) , 171 fluorinated , 3 polyethers , fluorinated heteroaromatic , 59 polyimide ( s ) ...
... chromium , 35 parylene , 3 , 21 PECVD , 41 , 119 , 127 , 137 , 143 , 165 , 183 , 189 perfluorocyclobutane ( PFCB ) , 3 , 35 , 177 poly ( aryl ) ether ( s ) , 171 fluorinated , 3 polyethers , fluorinated heteroaromatic , 59 polyimide ( s ) ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films