Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 9
... coefficient ( 90 ppm / ° C ) , and fairly low elongation ( 4 % ) , undoubtedly due to the high degree of crosslinking in the structure . The relatively high thermal expansion coefficient in a highly crosslinked polymer demonstrates that ...
... coefficient ( 90 ppm / ° C ) , and fairly low elongation ( 4 % ) , undoubtedly due to the high degree of crosslinking in the structure . The relatively high thermal expansion coefficient in a highly crosslinked polymer demonstrates that ...
Page 59
... coefficient of thermal expansion , me- chanical stability , planarization and mechanical properties are just a few examples . For organic polymers , the thermal stability is one of the most difficult criteria to fulfil . Only a small ...
... coefficient of thermal expansion , me- chanical stability , planarization and mechanical properties are just a few examples . For organic polymers , the thermal stability is one of the most difficult criteria to fulfil . Only a small ...
Page 96
... coefficients between the film and the surrounding atmosphere because of the high spin speeds , 2 ) the film thickness ... coefficient in air . The estimates presented in Figures 8 and 9 are conservative since they ignore evaporative ...
... coefficients between the film and the surrounding atmosphere because of the high spin speeds , 2 ) the film thickness ... coefficient in air . The estimates presented in Figures 8 and 9 are conservative since they ignore evaporative ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films