Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Results 1-3 of 9
Page 29
... cooling the stress returns to a tensile value higher than the initial value of the as - deposited film . The second thermal cycle , shown in the bottom graph of Figure 7b , repeats exactly the cooling curve of the first anneal cycle ...
... cooling the stress returns to a tensile value higher than the initial value of the as - deposited film . The second thermal cycle , shown in the bottom graph of Figure 7b , repeats exactly the cooling curve of the first anneal cycle ...
Page 37
... Cooling Figure 2 : Optical micrograph of Ta / PFCB surface after anneal at 350 ° C Loss of Adhesion 50 50 100 150 200 250 300 350 400 Temperature ( ° C ) Figure 3 : Plot of composite wafer curvature vs. Temperature for PFCB / Ta on an ...
... Cooling Figure 2 : Optical micrograph of Ta / PFCB surface after anneal at 350 ° C Loss of Adhesion 50 50 100 150 200 250 300 350 400 Temperature ( ° C ) Figure 3 : Plot of composite wafer curvature vs. Temperature for PFCB / Ta on an ...
Page 53
... cooling the samples to room temperature , the film stresses were measured from the curvature of the wafer at various temperatures using a Flexus apparatus . The tensile stress of cured films drops upon heating and reappears after cooling ...
... cooling the samples to room temperature , the film stresses were measured from the curvature of the wafer at various temperatures using a Flexus apparatus . The tensile stress of cured films drops upon heating and reappears after cooling ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films