Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 79
... Copper was either evaporated or sputtered . Adhesion of copper to fluoropolymers was studied using scratch and peel tests . Different thermal treatment techniques were applied to enhance adhesion , including preannealing in vacuum or in ...
... Copper was either evaporated or sputtered . Adhesion of copper to fluoropolymers was studied using scratch and peel tests . Different thermal treatment techniques were applied to enhance adhesion , including preannealing in vacuum or in ...
Page 80
... copper electrodes . Thermal stability was also evaluated by thermally cycling the samples . EXPERIMENTAL Fluoropolymer samples evaluated include plasma - polymerized ( PP ) C2F4 and C2F3H , sputtered ( SP ) Teflon PTFE , and spin ...
... copper electrodes . Thermal stability was also evaluated by thermally cycling the samples . EXPERIMENTAL Fluoropolymer samples evaluated include plasma - polymerized ( PP ) C2F4 and C2F3H , sputtered ( SP ) Teflon PTFE , and spin ...
Page 81
... copper deposition , and " post " indicates annealing after the copper deposition . The abbreviations “ atm ” and “ vac ” indicate , respectively , annealing under the atmosphere or in vacuum . All these treatments were performed at 200 ...
... copper deposition , and " post " indicates annealing after the copper deposition . The abbreviations “ atm ” and “ vac ” indicate , respectively , annealing under the atmosphere or in vacuum . All these treatments were performed at 200 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films