Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 92
... constant over a wide range , and 6 ) the ability to migrate the same dielectric material and integration scheme for multiple semiconductor technology nodes by tuning the dielectric constant to lower values . Although porosity leads to a ...
... constant over a wide range , and 6 ) the ability to migrate the same dielectric material and integration scheme for multiple semiconductor technology nodes by tuning the dielectric constant to lower values . Although porosity leads to a ...
Page 145
... dielectric constant calculated by Kramers - Kronig relation . 4 Figure 3 shows the dielectric constants obtained by C - V measurements and Kramers - Kronig relation . The relative dielectric constant of the SiOF films decreased with ...
... dielectric constant calculated by Kramers - Kronig relation . 4 Figure 3 shows the dielectric constants obtained by C - V measurements and Kramers - Kronig relation . The relative dielectric constant of the SiOF films decreased with ...
Page 155
... dielectric constants k > 3.3 appeared to be stable to anneals of 4 hours at 400 ° C in He , a film having a dielectric constant of 2.7 was not , losing more than half of its thickness upon exposure to the same anneal . The stresses in ...
... dielectric constants k > 3.3 appeared to be stable to anneals of 4 hours at 400 ° C in He , a film having a dielectric constant of 2.7 was not , losing more than half of its thickness upon exposure to the same anneal . The stresses in ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber