Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 92
... constant over a wide range , and 6 ) the ability to migrate the same dielectric material and integration scheme for multiple semiconductor technology nodes by tuning the dielectric constant to lower values . Although porosity leads to a ...
... constant over a wide range , and 6 ) the ability to migrate the same dielectric material and integration scheme for multiple semiconductor technology nodes by tuning the dielectric constant to lower values . Although porosity leads to a ...
Page 145
... dielectric constant calculated by Kramers - Kronig relation . 4 Figure 3 shows the dielectric constants obtained by C - V measurements and Kramers - Kronig relation . The relative dielectric constant of the SiOF films decreased with ...
... dielectric constant calculated by Kramers - Kronig relation . 4 Figure 3 shows the dielectric constants obtained by C - V measurements and Kramers - Kronig relation . The relative dielectric constant of the SiOF films decreased with ...
Page 155
... dielectric constants k > 3.3 appeared to be stable to anneals of 4 hours at 400 ° C in He , a film having a dielectric constant of 2.7 was not , losing more than half of its thickness upon exposure to the same anneal . The stresses in ...
... dielectric constants k > 3.3 appeared to be stable to anneals of 4 hours at 400 ° C in He , a film having a dielectric constant of 2.7 was not , losing more than half of its thickness upon exposure to the same anneal . The stresses in ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films