Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 105
... dielectric - constant mesoporous silica films were prepared by condensation of a silicate network around surfactant ... film thickness , porosity , refractive index and dielectric constant measured by ellipsometry are presented . Using ...
... dielectric - constant mesoporous silica films were prepared by condensation of a silicate network around surfactant ... film thickness , porosity , refractive index and dielectric constant measured by ellipsometry are presented . Using ...
Page 166
... film for the multilevel interconnection of integrated circuits , we must be able to fill the wiring gaps completely with the a - C : F film . Then , the deposition of the a - C : F film will be followed by the patterning , etching , and ...
... film for the multilevel interconnection of integrated circuits , we must be able to fill the wiring gaps completely with the a - C : F film . Then , the deposition of the a - C : F film will be followed by the patterning , etching , and ...
Page 167
... films was improved by using source compounds with lower F / C ratios ( Fig . 2 ) . The thickness of the a - C : F film grown from CF4 was reduced by 300 ° C annealing in a vacuum , but that of the C4Fg film was not . However , the ...
... films was improved by using source compounds with lower F / C ratios ( Fig . 2 ) . The thickness of the a - C : F film grown from CF4 was reduced by 300 ° C annealing in a vacuum , but that of the C4Fg film was not . However , the ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber