Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 15
... electrical properties , polyimide has received wide use in microelectronics as a dielectric material . Commercial polyimides for microelectronics applications are provided as solutions of a polyamic acid , that has been prepared by ...
... electrical properties , polyimide has received wide use in microelectronics as a dielectric material . Commercial polyimides for microelectronics applications are provided as solutions of a polyamic acid , that has been prepared by ...
Page 21
... electrical performance in a device and dry etching for via formation . We report results on the evaluation of Parylene AF - 4 , deposited by vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition ...
... electrical performance in a device and dry etching for via formation . We report results on the evaluation of Parylene AF - 4 , deposited by vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition ...
Page 157
dielectric constants were measured at 1 MHz . For the electrical resistivity measurements , the current density was measured as a function of the electric field . Details of the electrical characterization techniques can be found ...
dielectric constants were measured at 1 MHz . For the electrical resistivity measurements , the current density was measured as a function of the electric field . Details of the electrical characterization techniques can be found ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films