Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 10
... example , FDLC films with ɛ = 2.8 exhibit apparent thermal stability at 400 ° C and compressive stress below 300 MPa . Takeishi and several co - workers at Fujitsu recently reported on PECVD - deposited fluorocarbon films [ 33 ] using a ...
... example , FDLC films with ɛ = 2.8 exhibit apparent thermal stability at 400 ° C and compressive stress below 300 MPa . Takeishi and several co - workers at Fujitsu recently reported on PECVD - deposited fluorocarbon films [ 33 ] using a ...
Page 59
... examples , the influence of the chemical structure of the polymers on properties such as glass transition temperature , solubility , and thermal stability will be discussed . Structural parameters stu- died are the number and nature of ...
... examples , the influence of the chemical structure of the polymers on properties such as glass transition temperature , solubility , and thermal stability will be discussed . Structural parameters stu- died are the number and nature of ...
Page 93
... example , Fig . 2 ) . This precludes the use of the Ambient Pressure Aerogel ( APA ) approach which uses surface modification to allow gel shrinkage during drying but enables springback to yield a final low density . The best approach ...
... example , Fig . 2 ) . This precludes the use of the Ambient Pressure Aerogel ( APA ) approach which uses surface modification to allow gel shrinkage during drying but enables springback to yield a final low density . The best approach ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber