Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 79
... fluoropolymers and copper were studied . The types of polymers in this study include sputtered Teflon , plasma - deposited fluoropolymers and the soluble Teflon AF1600 . All these fluoropolymers have dielectric constants below 2.0 and ...
... fluoropolymers and copper were studied . The types of polymers in this study include sputtered Teflon , plasma - deposited fluoropolymers and the soluble Teflon AF1600 . All these fluoropolymers have dielectric constants below 2.0 and ...
Page 80
... fluoropolymer interface [ 3-5 ] . The major part of this work was concerned with increasing the adhesion of Cu deposited onto the fluoropolymers . Using the microscratch tester to evaluate this adhesion , we measured the critical load ...
... fluoropolymer interface [ 3-5 ] . The major part of this work was concerned with increasing the adhesion of Cu deposited onto the fluoropolymers . Using the microscratch tester to evaluate this adhesion , we measured the critical load ...
Page 81
... fluoropolymers measured by MST and peel test . As - deposited fluorocarbon films exhibited unstable dielectric properties . Stability was obtained after annealing at 200 C ° for 30 minutes in vacuum which generally leads to desorption ...
... fluoropolymers measured by MST and peel test . As - deposited fluorocarbon films exhibited unstable dielectric properties . Stability was obtained after annealing at 200 C ° for 30 minutes in vacuum which generally leads to desorption ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber