Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 29
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
Page 65
... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and ...
... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and ...
Page 66
... Glass transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 ...
... Glass transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films