Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 29
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
Page 65
... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and ...
... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and ...
Page 66
... Glass transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 ...
... Glass transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber