Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 29
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
... glass transition temperature ( Tg ) and melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of ...
Page 65
... temperature , and 14d - g withstand even boiling chloroform . This is in contrast to the behavior of common amor ... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the ...
... temperature , and 14d - g withstand even boiling chloroform . This is in contrast to the behavior of common amor ... Glass transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the ...
Page 66
... glass transition temperatures than the analogous oxazole polymers 14 ( 15a / 14b , 15b / 14c , 15c / 14e , 15d / 14g ) . This effect is caused by the different geometries of the oxazole and thiazole rings . Whi- le the angle between the ...
... glass transition temperatures than the analogous oxazole polymers 14 ( 15a / 14b , 15b / 14c , 15c / 14e , 15d / 14g ) . This effect is caused by the different geometries of the oxazole and thiazole rings . Whi- le the angle between the ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber