Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Results 1-3 of 8
Page 45
... hardness and elastic modulus [ 16 ] . The results are presented in Table 3. For reference , the hardness as measured on SiO2 and sputtered Al are 8-10 , and 1 - 2 GPa respectively . A hardness value for parylene of 0.56 GPa has been ...
... hardness and elastic modulus [ 16 ] . The results are presented in Table 3. For reference , the hardness as measured on SiO2 and sputtered Al are 8-10 , and 1 - 2 GPa respectively . A hardness value for parylene of 0.56 GPa has been ...
Page 53
... hardness and modulus of fused silica in comparison with a variety of hybrid PI / PSSQ compositions are shown in Table I. As expected , both the hardness and the modulus of the hybrid materials decreased with increasing polyimide ...
... hardness and modulus of fused silica in comparison with a variety of hybrid PI / PSSQ compositions are shown in Table I. As expected , both the hardness and the modulus of the hybrid materials decreased with increasing polyimide ...
Page 203
... hardness , 41 hexafluoropropylene , 41 imidization , 71 inductive effects , 111 ir spectroscopy , 71 , 111 mechanical properties , 47 , 79 metal interconnects , delays , 3 modeling , 183 moisture absorption , 119 , 149 monomers , 59 ...
... hardness , 41 hexafluoropropylene , 41 imidization , 71 inductive effects , 111 ir spectroscopy , 71 , 111 mechanical properties , 47 , 79 metal interconnects , delays , 3 modeling , 183 moisture absorption , 119 , 149 monomers , 59 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films