Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 65
... dielectrics applications , since less residual stress in a polymeric interlayer dielectric can be expected , when the material does not experience any phase transitions on cooling from processing temperatures ( which can be as high as ...
... dielectrics applications , since less residual stress in a polymeric interlayer dielectric can be expected , when the material does not experience any phase transitions on cooling from processing temperatures ( which can be as high as ...
Page 71
... DIELECTRIC IN ULSI Y.K. Lee , S.P.Murarka ' , and B. Auman b ' Center for Intergrated Electronics and Electronic ... interlayer dielectric ( ILD ) materials due to their excellent properties such as low dielectric constant , ease of ...
... DIELECTRIC IN ULSI Y.K. Lee , S.P.Murarka ' , and B. Auman b ' Center for Intergrated Electronics and Electronic ... interlayer dielectric ( ILD ) materials due to their excellent properties such as low dielectric constant , ease of ...
Page 119
... interlayer dielectrics has increased to five or six layers . [ 2 ~ 6 ] In sub - half micron interconnection , the requirements for interlayer dielectric film include narrow wiring gap - fill without void formation , global planarization ...
... interlayer dielectrics has increased to five or six layers . [ 2 ~ 6 ] In sub - half micron interconnection , the requirements for interlayer dielectric film include narrow wiring gap - fill without void formation , global planarization ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber