Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 3
... low dielectric constant ( low ɛ ) materials which possess all of the required properties and processing characteristics needed for integration into standard IC fabrication lines . To date , no material candidate has been shown to ...
... low dielectric constant ( low ɛ ) materials which possess all of the required properties and processing characteristics needed for integration into standard IC fabrication lines . To date , no material candidate has been shown to ...
Page 85
EVALUATION OF PTFE NANOEMULSION AS A LOW DIELECTRIC CONSTANT MATERIAL ILD S. C. SUN ** , Y. C. CHIANG * , C. T. ROSENMAYER ** , J. TEGUH ** , H. WU , ** * National Nano Device Laboratory , National Chiao ... Low-Dielectric Constant Material.
EVALUATION OF PTFE NANOEMULSION AS A LOW DIELECTRIC CONSTANT MATERIAL ILD S. C. SUN ** , Y. C. CHIANG * , C. T. ROSENMAYER ** , J. TEGUH ** , H. WU , ** * National Nano Device Laboratory , National Chiao ... Low-Dielectric Constant Material.
Page 155
... low - k dielectrics for the back end of the line ( BEOL ) interconnect structures in ULSI circuits . Hydrogenated ... dielectric constant ( k ) of the DLC films can be varied between > 3.3 and 2.7 by changing the deposition conditions . The ...
... low - k dielectrics for the back end of the line ( BEOL ) interconnect structures in ULSI circuits . Hydrogenated ... dielectric constant ( k ) of the DLC films can be varied between > 3.3 and 2.7 by changing the deposition conditions . The ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber