Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 91
... material ( silica ) . We have previously reported success in synthesizing low density , low dielectric constant ( K < 2 ) thin films using ambient pressure processing . However , processing of those films was complicated due to large ...
... material ( silica ) . We have previously reported success in synthesizing low density , low dielectric constant ( K < 2 ) thin films using ambient pressure processing . However , processing of those films was complicated due to large ...
Page 155
... materials were investigated for their potential applications as low - k dielectrics for the back end of the line ( BEOL ) interconnect structures in ULSI circuits . Hydrogenated DLC and fluorine containing DLC ( FDLC ) were studied as a low ...
... materials were investigated for their potential applications as low - k dielectrics for the back end of the line ( BEOL ) interconnect structures in ULSI circuits . Hydrogenated DLC and fluorine containing DLC ( FDLC ) were studied as a low ...
Page 195
... low - k values observed . INTRODUCTION constants · · The semiconductor industry has long been expecting the use of materials with reduced dielectric commonly referred to as low - k materials to replace conventional intermetal ...
... low - k values observed . INTRODUCTION constants · · The semiconductor industry has long been expecting the use of materials with reduced dielectric commonly referred to as low - k materials to replace conventional intermetal ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films