Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page ix
... materials range from the evolution of silicon dioxide to fluorinated silicate glass , to the use of inorganic / organic polymers and spin - on - material , to fluorinated diamond - like carbon and nanoporous silica . The symposium also ...
... materials range from the evolution of silicon dioxide to fluorinated silicate glass , to the use of inorganic / organic polymers and spin - on - material , to fluorinated diamond - like carbon and nanoporous silica . The symposium also ...
Page 4
... materials for IMD . It is somewhat surprising that at present , the interest among the IC community in low & materials is not only widespread among the producers of logic chips , but is growing among producers of memory chips as well ...
... materials for IMD . It is somewhat surprising that at present , the interest among the IC community in low & materials is not only widespread among the producers of logic chips , but is growing among producers of memory chips as well ...
Page 41
... materials commonly employed in device fabrication . However , recent advances in tighter interconnect packing and the drive toward higher processor speeds and lower power consumption has spurred a search for insulating materials with a ...
... materials commonly employed in device fabrication . However , recent advances in tighter interconnect packing and the drive toward higher processor speeds and lower power consumption has spurred a search for insulating materials with a ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films