Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 48
... matrix polymer and the additive as well . Such nano - level phase separation in inorganic - organic hybrids have been reported by Chujo and co - workers and others . In such cases , the organic polymer must be thermally stable to allow ...
... matrix polymer and the additive as well . Such nano - level phase separation in inorganic - organic hybrids have been reported by Chujo and co - workers and others . In such cases , the organic polymer must be thermally stable to allow ...
Page 56
... matrix . Although these materials can provide a variety of film morphologies depending on the composition , solvent , processing conditions , etc. , controlled nanoscale phase separation can be achieved even in thin films ( 1-2 μm ) by ...
... matrix . Although these materials can provide a variety of film morphologies depending on the composition , solvent , processing conditions , etc. , controlled nanoscale phase separation can be achieved even in thin films ( 1-2 μm ) by ...
Page 97
... matrix strength is extremely low . As polymerization and rearrangement reactions continue , " necks " are built up between the individual units in a process normally known as aging and as shown in Figure 10. As necks continue to grow ...
... matrix strength is extremely low . As polymerization and rearrangement reactions continue , " necks " are built up between the individual units in a process normally known as aging and as shown in Figure 10. As necks continue to grow ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber