Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
From inside the book
Results 1-3 of 32
Page 49
... mechanical properties of the functionalized oligomer are also shown in Figure 2.14 The resulting oligomers could be imidized ( IR analysis ) by heating to 400 ° C in nitrogen . Chain extension and crosslinking of the oligomers occur ...
... mechanical properties of the functionalized oligomer are also shown in Figure 2.14 The resulting oligomers could be imidized ( IR analysis ) by heating to 400 ° C in nitrogen . Chain extension and crosslinking of the oligomers occur ...
Page 91
... mechanical properties due to controlled pore size and narrow pore size distribution and also because of higher density . The trade - offs between density , mechanical strength and dielectric constant for these types of porous solids ...
... mechanical properties due to controlled pore size and narrow pore size distribution and also because of higher density . The trade - offs between density , mechanical strength and dielectric constant for these types of porous solids ...
Page 97
AGING Gel point Partially aged Optimum strength 8800 The mechanical properties of nanoporous silica are not the same as dense silica . The quantitative description of mechanical properties is complicated because of their very fine ...
AGING Gel point Partially aged Optimum strength 8800 The mechanical properties of nanoporous silica are not the same as dense silica . The quantitative description of mechanical properties is complicated because of their very fine ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
23 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber