Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 49
... mechanical properties of the functionalized oligomer are also shown in Figure 2.14 The resulting oligomers could be imidized ( IR analysis ) by heating to 400 ° C in nitrogen . Chain extension and crosslinking of the oligomers occur ...
... mechanical properties of the functionalized oligomer are also shown in Figure 2.14 The resulting oligomers could be imidized ( IR analysis ) by heating to 400 ° C in nitrogen . Chain extension and crosslinking of the oligomers occur ...
Page 91
... mechanical properties due to controlled pore size and narrow pore size distribution and also because of higher density . The trade - offs between density , mechanical strength and dielectric constant for these types of porous solids ...
... mechanical properties due to controlled pore size and narrow pore size distribution and also because of higher density . The trade - offs between density , mechanical strength and dielectric constant for these types of porous solids ...
Page 97
AGING Gel point Partially aged Optimum strength 8800 The mechanical properties of nanoporous silica are not the same as dense silica . The quantitative description of mechanical properties is complicated because of their very fine ...
AGING Gel point Partially aged Optimum strength 8800 The mechanical properties of nanoporous silica are not the same as dense silica . The quantitative description of mechanical properties is complicated because of their very fine ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films