Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 29
... melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of crystalline regions . Thus in a ...
... melting temperature ( Tm ) . The glass transition temperature ( Tg ) is observed due to the presence of amorphous region of a polymer while a crystalline melting ( Tm ) due to the presence of crystalline regions . Thus in a ...
Page 40
Table 1 . Thermal Properties of Metal Fluorides Compound Group Melting Point ( ° C ) Boiling Point ( ° C ) Sublimation Temperature ( ° C ) TaF5 Vb 96.8 229.5 TiF4 IVb > 400 284 WF6 Vlb 2.5 17.5 MoF6 Vlb 17.5 35 CrF2 Vlb 1100 > 1300 CrF3 ...
Table 1 . Thermal Properties of Metal Fluorides Compound Group Melting Point ( ° C ) Boiling Point ( ° C ) Sublimation Temperature ( ° C ) TaF5 Vb 96.8 229.5 TiF4 IVb > 400 284 WF6 Vlb 2.5 17.5 MoF6 Vlb 17.5 35 CrF2 Vlb 1100 > 1300 CrF3 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films