Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 36
... metals used to form the interconnect wiring . Also , an interface formed when the polymer is applied onto a given metal is usually different than the interface formed when the same metal is deposited onto the polymer . A robust ...
... metals used to form the interconnect wiring . Also , an interface formed when the polymer is applied onto a given metal is usually different than the interface formed when the same metal is deposited onto the polymer . A robust ...
Page 40
... metal fluorides proceeds swiftly at the interface . The susceptibility of the balance of the metal film to react with fluorine in the PFCB is limited by the stability of the metal fluoride formed at the interface . Transition metal ...
... metal fluorides proceeds swiftly at the interface . The susceptibility of the balance of the metal film to react with fluorine in the PFCB is limited by the stability of the metal fluoride formed at the interface . Transition metal ...
Page 103
... metal lines . SEM micrograph ( Figure 3b ) showed no delamination between metal lines and xerogel and metal line sidewalls looked straight . It can be concluded that xerogel filled gaps between patterned metal lines just as good as ...
... metal lines . SEM micrograph ( Figure 3b ) showed no delamination between metal lines and xerogel and metal line sidewalls looked straight . It can be concluded that xerogel filled gaps between patterned metal lines just as good as ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber