Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 6
... modulus . In some cases , fluorinated polyimides exhibit modulus values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values ...
... modulus . In some cases , fluorinated polyimides exhibit modulus values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values ...
Page 45
... modulus . Higher deposition temperature also improves the hardness and modulus , but only slightly . Six samples were subjected to a 400 ° C thermal anneal in an atmospheric pressure nitrogen ambient . The sequence of this treatment was ...
... modulus . Higher deposition temperature also improves the hardness and modulus , but only slightly . Six samples were subjected to a 400 ° C thermal anneal in an atmospheric pressure nitrogen ambient . The sequence of this treatment was ...
Page 88
... modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a relatively thick ( ~ 10 μm ) carrier film . In ...
... modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a relatively thick ( ~ 10 μm ) carrier film . In ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber