Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 6
... modulus . In some cases , fluorinated polyimides exhibit modulus values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values ...
... modulus . In some cases , fluorinated polyimides exhibit modulus values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values ...
Page 45
... modulus . Higher deposition temperature also improves the hardness and modulus , but only slightly . Six samples were subjected to a 400 ° C thermal anneal in an atmospheric pressure nitrogen ambient . The sequence of this treatment was ...
... modulus . Higher deposition temperature also improves the hardness and modulus , but only slightly . Six samples were subjected to a 400 ° C thermal anneal in an atmospheric pressure nitrogen ambient . The sequence of this treatment was ...
Page 88
... modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a relatively thick ( ~ 10 μm ) carrier film . In ...
... modulus of PTFE . Wafers that passed the thermal shock test had a stud pull test value of less than 100 psi . We have conducted limited 90 ° peel testing . This requires the deposition of a relatively thick ( ~ 10 μm ) carrier film . In ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films