Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 11
... Nanoporous silica is unique among thin film dielectrics in that the e's can be extremely low ( approaching 1 ) , while the thermal stability is essentially that of conventional SiO2 . In addition to possessing higher thermal stability ...
... Nanoporous silica is unique among thin film dielectrics in that the e's can be extremely low ( approaching 1 ) , while the thermal stability is essentially that of conventional SiO2 . In addition to possessing higher thermal stability ...
Page 91
NANOPOROUS SILICA FOR LOW K DIELECTRICS Teresa Ramos , Kevin Roderick , Alok Maskara , and Douglas M. Smith Nanoglass LLC , 3500 Garrett Ave. , Santa Clara , CA 95054-2827 , USA ABSTRACT Considerable progress has been made in ...
NANOPOROUS SILICA FOR LOW K DIELECTRICS Teresa Ramos , Kevin Roderick , Alok Maskara , and Douglas M. Smith Nanoglass LLC , 3500 Garrett Ave. , Santa Clara , CA 95054-2827 , USA ABSTRACT Considerable progress has been made in ...
Page 92
... nanoporous silica parameter controlling properties of importance for dielectrics ' . Properties of nanoporous silica may be varied over a continuous spectrum from the extremes of an air gap at a porosity of 100 % to dense silica with a ...
... nanoporous silica parameter controlling properties of importance for dielectrics ' . Properties of nanoporous silica may be varied over a continuous spectrum from the extremes of an air gap at a porosity of 100 % to dense silica with a ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films