Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 35
... patterns with air is difficult . Figure 1 shows the structure and polymerization process of PFCB , a fluorinated aromatic thermosetting polymer . The dielectric constant of PFCB at 2.35 is well below the range of competing polymer ...
... patterns with air is difficult . Figure 1 shows the structure and polymerization process of PFCB , a fluorinated aromatic thermosetting polymer . The dielectric constant of PFCB at 2.35 is well below the range of competing polymer ...
Page 106
... patterns before and after calcination of a mesoporous silica film prepared with a CTAC / TEOS ratio of 0.12 . The diffraction results for this particular composition is comparable to the hexagonally ordered films created by the ...
... patterns before and after calcination of a mesoporous silica film prepared with a CTAC / TEOS ratio of 0.12 . The diffraction results for this particular composition is comparable to the hexagonally ordered films created by the ...
Page 107
... patterns ( A ) before and ( B ) after calcination of a mesoporous silica film directly on the wafer with a CTAC / TEOS molar ratio of 0.12 . 44 d - spacing / Å 42 40 Q 38 36 34 32 30 ᄆ △ as synthesized calcined 0.00 0.05 0.10 0.15 ...
... patterns ( A ) before and ( B ) after calcination of a mesoporous silica film directly on the wafer with a CTAC / TEOS molar ratio of 0.12 . 44 d - spacing / Å 42 40 Q 38 36 34 32 30 ᄆ △ as synthesized calcined 0.00 0.05 0.10 0.15 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber