Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
From inside the book
Results 1-2 of 2
Page 80
... percentage of remaining copper was estimated . Dielectric measurements were performed , using a HP 4274A multi - frequency LCR meter , at frequencies ranging from 100 Hz to 10 MHz . The samples were stabilized by annealing at 200 ° C ...
... percentage of remaining copper was estimated . Dielectric measurements were performed , using a HP 4274A multi - frequency LCR meter , at frequencies ranging from 100 Hz to 10 MHz . The samples were stabilized by annealing at 200 ° C ...
Page 81
... Percentage of Copper Critical Load ( N ) Critical Load ( N ) Remaining Adhered 1.5 625150 2 - Microscratch Test for Sputtered Copper Microscratch Test for Evaporated Copper Pool Test for Evaporated Copper A. a . 112284 ( HC2F3 ...
... Percentage of Copper Critical Load ( N ) Critical Load ( N ) Remaining Adhered 1.5 625150 2 - Microscratch Test for Sputtered Copper Microscratch Test for Evaporated Copper Pool Test for Evaporated Copper A. a . 112284 ( HC2F3 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
23 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films