Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 79
... permittivity dielectric / metal system consisting of fluoropolymers and copper were studied . The types of polymers in this study include sputtered Teflon , plasma - deposited fluoropolymers and the soluble Teflon AF1600 . All these ...
... permittivity dielectric / metal system consisting of fluoropolymers and copper were studied . The types of polymers in this study include sputtered Teflon , plasma - deposited fluoropolymers and the soluble Teflon AF1600 . All these ...
Page 99
... permittivity intermetal dielectric materials . Porous silica xerogel films have low dielectric permittivity through the incorporation of micropores into the SiO2 network . A feasible xerogel process has been developed . Crack - free and ...
... permittivity intermetal dielectric materials . Porous silica xerogel films have low dielectric permittivity through the incorporation of micropores into the SiO2 network . A feasible xerogel process has been developed . Crack - free and ...
Page 101
... permittivity and cause metal interconnect integration problems . The surface silanol groups also formed Si - O - Si bonds through condensation reactions during drying , causing permanent shrinkage of the film . To reduce moisture ...
... permittivity and cause metal interconnect integration problems . The surface silanol groups also formed Si - O - Si bonds through condensation reactions during drying , causing permanent shrinkage of the film . To reduce moisture ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber