Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 35
... polymer dielectric derived from tris - perfluorocyclobutene ( PFCB ) monomer has been investigated as a thin film ... polymer and metals at the interfaces . In particular , the interfaces formed by the deposition of Cr or Co onto PFCB ...
... polymer dielectric derived from tris - perfluorocyclobutene ( PFCB ) monomer has been investigated as a thin film ... polymer and metals at the interfaces . In particular , the interfaces formed by the deposition of Cr or Co onto PFCB ...
Page 48
... polymer , it is important that the polymer contain reactive functionality which becomes chemically incorporated into the growing silicate during condensation and additionally there should be strong interactions ( e.g. , hydrogen bonding ) ...
... polymer , it is important that the polymer contain reactive functionality which becomes chemically incorporated into the growing silicate during condensation and additionally there should be strong interactions ( e.g. , hydrogen bonding ) ...
Page 65
... polymer . Most crystalline polymers are insoluble at ambient or even elevated tem- peratures , except in aggressive , toxic solvents such as sulfuric acids , cresols , chlorinated aromatics , or hexafluoroisopropanol . the introduction ...
... polymer . Most crystalline polymers are insoluble at ambient or even elevated tem- peratures , except in aggressive , toxic solvents such as sulfuric acids , cresols , chlorinated aromatics , or hexafluoroisopropanol . the introduction ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber