Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 41
FLUOROCARBON FILMS FROM PLASMA POLYMERIZATION OF HEXAFLUOROPROPYLENE AND HYDROGEN T. W. Mountsier and D. Kumar Novellus Systems , Inc. , 3970 N. First Street , San Jose , CA 95134 ABSTRACT Fluorocarbon polymers exhibit excellent ...
FLUOROCARBON FILMS FROM PLASMA POLYMERIZATION OF HEXAFLUOROPROPYLENE AND HYDROGEN T. W. Mountsier and D. Kumar Novellus Systems , Inc. , 3970 N. First Street , San Jose , CA 95134 ABSTRACT Fluorocarbon polymers exhibit excellent ...
Page 65
... polymers 14 ( except 14c ) are not soluble in chloroform at room temperature , and 14d - g withstand even boiling ... polymers discussed here are also soluble in the non polar sol- vent toluene . Exceptions are those polymers which are ...
... polymers 14 ( except 14c ) are not soluble in chloroform at room temperature , and 14d - g withstand even boiling ... polymers discussed here are also soluble in the non polar sol- vent toluene . Exceptions are those polymers which are ...
Page 66
... polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 220 195 180 200 g DSC , 20 K / min From ...
... polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 220 195 180 200 g DSC , 20 K / min From ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films