Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 92
... porosity , and the role of surface chemistry on dielectric constant , loss and environmental stability . Density ( or the inverse , porosity ) is the key nanoporous silica parameter controlling properties of importance for dielectrics ...
... porosity , and the role of surface chemistry on dielectric constant , loss and environmental stability . Density ( or the inverse , porosity ) is the key nanoporous silica parameter controlling properties of importance for dielectrics ...
Page 99
... porosity were readily coated . Xerogel materials completely filled 0.3 μm wide gaps with a 2 : 1 aspect ratio . MOSCAP measurements revealed a low permittivity and high dielectric breakdown strength . The dielectric breakdown strength ...
... porosity were readily coated . Xerogel materials completely filled 0.3 μm wide gaps with a 2 : 1 aspect ratio . MOSCAP measurements revealed a low permittivity and high dielectric breakdown strength . The dielectric breakdown strength ...
Page 101
... porosity ranging from 50 % - 90 % , corresponding to dielectric constants of 2.5 - 1.3 . The porosity , and therefore the relative permittivity , were tuned by varying the solid content in the precursor . 1.0 COS ( DELTA ) TAN ( PSI ) ...
... porosity ranging from 50 % - 90 % , corresponding to dielectric constants of 2.5 - 1.3 . The porosity , and therefore the relative permittivity , were tuned by varying the solid content in the precursor . 1.0 COS ( DELTA ) TAN ( PSI ) ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber