Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 99
... Porous silica xerogel films have low dielectric permittivity through the incorporation of micropores into the SiO2 network . A feasible xerogel process has been developed . Crack - free and uniform silica xerogel films up to two microns ...
... Porous silica xerogel films have low dielectric permittivity through the incorporation of micropores into the SiO2 network . A feasible xerogel process has been developed . Crack - free and uniform silica xerogel films up to two microns ...
Page 103
... xerogel material was not mechanically strong enough to prevent this ... xerogel and metal line sidewalls looked straight . It can be concluded that xerogel filled ... porous SiO2 film . The underlying porous silica film maintained its 103.
... xerogel material was not mechanically strong enough to prevent this ... xerogel and metal line sidewalls looked straight . It can be concluded that xerogel filled ... porous SiO2 film . The underlying porous silica film maintained its 103.
Page 104
SiO2 film . The underlying porous silica film maintained its porosity . The etchability of xerogel films was also established . Silica xerogel films with 75 % porosity etched five ( 5 ) times faster than PETEOS under CF4 / O2 plasma ...
SiO2 film . The underlying porous silica film maintained its porosity . The etchability of xerogel films was also established . Silica xerogel films with 75 % porosity etched five ( 5 ) times faster than PETEOS under CF4 / O2 plasma ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber