Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 108
... ratio ) may exist . The different ordered phases are difficult to characterize by the diffraction technique , however , because structural information can be lost due to orientation within the film . At low concentrations , the ...
... ratio ) may exist . The different ordered phases are difficult to characterize by the diffraction technique , however , because structural information can be lost due to orientation within the film . At low concentrations , the ...
Page 121
... ratio 1.38 1.40 1.42 1.44 1.46 1.48 1.50 1.52 Refractive Index Fig . 2 The plot of dielectric constant vs. refractive index The surface topography of the SiOF films with various SiF4 / O2 flow ratios is shown in Fig . 3 . The surface ...
... ratio 1.38 1.40 1.42 1.44 1.46 1.48 1.50 1.52 Refractive Index Fig . 2 The plot of dielectric constant vs. refractive index The surface topography of the SiOF films with various SiF4 / O2 flow ratios is shown in Fig . 3 . The surface ...
Page 184
... ratio yielded approximately 3 % Si - F / Si - O ratio . After optimization , 3 % Si - F / Si - O ratio HDPCVD FSG films on 200mm wafers with thickness and fluorine uniformities under 4 % and 0.2 atomic percent were obtained ...
... ratio yielded approximately 3 % Si - F / Si - O ratio . After optimization , 3 % Si - F / Si - O ratio HDPCVD FSG films on 200mm wafers with thickness and fluorine uniformities under 4 % and 0.2 atomic percent were obtained ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films